ADA4930-2YCPZ-R2 datasheet(7/25 Pages) AD

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Data Sheet

ADA4930-1/ADA4930-2

Rev. C | Page 7 of 25

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

Supply Voltage

5.5 V

Power Dissipation

See Figure 4

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +105°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the device (including exposed pad) soldered

to a high thermal conductivity 2s2p circuit board, as described

in EIA/JESD51-7.

Table 8. Thermal Resistance

Package Type

θJA

Unit

16-Lead LFCSP (Exposed Pad)

°C/W

24-Lead LFCSP (Exposed Pad)

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4930-1/

ADA4930-2 packages is limited by the associated rise in

junction temperature (TJ) on the die. At approximately 150°C,

which is the glass transition temperature, the plastic changes its

properties. Even temporarily exceeding this temperature limit

can change the stresses that the package exerts on the die,

permanently shifting the parametric performance of the

ADA4930-1/ADA4930-2. Exceeding a junction temperature of

150°C for an extended period can result in changes in the

silicon devices, potentially causing failure.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive. The quiescent power is the voltage

between the supply pins (VS) times the quiescent current (IS).

The power dissipated due to the load drive depends upon the

particular application. The power due to load drive is calculated

by multiplying the load current by the associated voltage drop

across the device. RMS voltages and currents must be used in

these calculations.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more metal directly in contact with the package leads/

exposed pad from metal traces, through holes, ground, and

power planes reduces θJA.

Figure 4 shows the maximum safe power dissipation vs. the

ambient temperature for the ADA4930-1 single 16-lead LFCSP

(98°C/W) and the ADA4930-2 dual 24-lead LFCSP (67°C/W)

on a JEDEC standard 4-layer board.

3.5

–40

110

90 100

TEMPERATURE (°C)

0.5

1.0

1.5

2.0

2.5

3.0

–30 –20 –10 0

10 20 30 40 50 60 70 80

ADA4930-2

ADA4930-1

Figure 4. Maximum Power Dissipation vs. Ambient Temperature,

4-Layer Board

ESD CAUTION

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