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UBA2033 数据表(PDF) 8 Page - NXP Semiconductors |
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UBA2033 数据表(HTML) 8 Page - NXP Semiconductors |
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8 / 20 page ![]() 2002 Oct 08 8 Philips Semiconductors Product specification HF full bridge driver IC UBA2033 THERMAL CHARACTERISTICS QUALITY SPECIFICATION In accordance with “SNW-FQ-611D”. CHARACTERISTICS Tj =25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC; unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air 100 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT High voltage IHV high voltage supply current t < 0.5 s and VHV = 550 V 0 − 30 µA IFSL, IFSR high voltage floating supply current t < 0.5 s and VFSL =VFSR = 564 V 0 − 30 µA Start-up; powered via pin HV Ii(HV) HV input current VHV = 11 V; note 1 − 0.5 1.0 mA VHV(rel) level of release power drive voltage 11 12.5 14 V VHV(UVLO) reset level of power drive voltage 8.5 10 11.5 V VHV(hys) HV hysteresis voltage 2.0 2.5 3.0 V VDD internal supply voltage VHV = 20 V 10.5 11.5 13.5 V Start-up; powered via pin VDD Ii(DD) VDD input current VDD = 8.25 V; note 2 − 0.5 1.0 mA VDD(rel) level of release power drive voltage 8.25 9.0 9.75 V VDD(UVLO) reset level of power drive voltage 5.75 6.5 7.25 V VDD(hys) hysteresis voltage 2.0 2.5 3.0 V Output stage Ron(H) higher MOSFETs on resistance VFSR =VFSL = 12 V (with respect to SHR and SHL); Isource =50mA 15 21 26 Ω Roff(H) higher MOSFETs off resistance VFSR =VFSL = 12 V (with respect to SHR and SHL); Isink =50mA 914 18 Ω Ron(L) lower MOSFETs on resistance VDD =12V; Isource =50mA 15 21 26 Ω Roff(L) lower MOSFETs off resistance VDD =12V; Isink = 50 mA 9 14 18 Ω Io(source) output source current VDD =VFSL =VFSR =12V; VGHR =VGHL =VGLR =VGLL =0V 130 180 − mA Io(sink) output sink current VDD =VFSL =VFSR =12V; VGHR =VGHL =VGLR =VGLL =12V 150 200 − mA Vdiode bootstrap diode voltage drop Idiode = 20 mA 1.7 2.1 2.5 V tno non-overlap time −− 250 ns VFSL HS lockout voltage left 3.0 4.0 5.0 V |
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