2002 Oct 08

13

Philips Semiconductors

Product specification

HF full bridge driver IC

UBA2033

PACKAGE OUTLINE

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

10.4

10.0

5.4

5.2

0.65

1.25

7.9

7.6

0.9

0.7

1.1

0.7

8

0

o

o

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT341-1

MO-150

95-02-04

99-12-27

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

114

28

15

0.25

y

pin 1 index

0

2.5

5 mm

scale

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

SOT341-1

A

max.

2.0