AX−SFAZ, AX−SFAZ−API

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17

QFN40 PACKAGE INFORMATION

QFN40 7x5, 0.5P

CASE 485EG

ISSUE A

SEATING

NOTE 4

0.15

C

(A3)

A

A1

D2

b

1

21

40

2X

2X

E2

40X

9

L

40X

BOTTOM VIEW

DETAIL A

TOP VIEW

SIDE VIEW

D

A B

E

0.15

C

PIN ONE

REFERENCE

0.10

C

0.08

C

C

29

e

A

0.10

B

C

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSIONS: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30mm FROM TERMINAL

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

7.00 BSC

D2

5.30

5.50

E

5.00 BSC

3.50

E2

3.30

e

0.50 BSC

L

0.30

0.50

L1

−−−

0.15

PLANE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

e/2

NOTE 3

DIMENSIONS: MILLIMETERS

0.50

5.60

0.32

3.60

40X

0.60

40X

5.30

7.30

1

PITCH

PACKAGE

OUTLINE

RECOMMENDED

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTION

DETAIL B