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AR0238CSSC12SHRA0-DP 数据表(PDF) 7 Page - ON Semiconductor

部件名 AR0238CSSC12SHRA0-DP
功能描述  2.1 Mp/Full HD Digital Image Sensor
PDF  26 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

AR0238CSSC12SHRA0-DP 数据表(HTML) 7 Page - ON Semiconductor

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Table 3. PIN DESCRIPTIONS, HiSPi 48−Lead mPLCC
DS Name
mPLCC Pin
Type
Description
SLVSC_N
1
Output
HiSPi serial DDR clock differential N
SLVS1_P
2
Output
HiSPi serial data, lane 1, differential P
SLVS1_N
3
Output
HiSPi serial data, lane 1, differential N
SLVS0_P
4
Output
HiSPi serial data, lane 0, differential P
SLVS0_N
5
Output
HiSPi serial data, lane 0, differential N
VDD_SLVS
6
Power
0.3 V−0.6 V or 1.7 V − 1.9 V port to HiSPi Output Driver. Set the High_VCM
(R0x306E[9]) bit to 1 when configuring VDD_SLVS to 1.7 V – 1.9 V.
DGND
7, 14, 18, 32, 40
Power
Digital ground
VDD_PLL
8
Power
PLL power, 2.8 V nominal
EXTCLK
9
Input
External input clock
VAA
10, 16, 35, 37
Power
Analog power, 2.8 V nominal
AGND
11, 17, 33, 39
Power
Analog ground.
VDD_IO
12, 20, 30, 42
Power
I/O supply power, 1.8/2.8 V nominal
VDD
13, 19, 31, 41, 43
Power
Digital power, 1.8 V nominal
Reserved
15
Reserved, NC
FLASH
21
Output
Flash control output
TEST
22
Input
Manufacturing test enable pin (connect to Dgnd)
SDATA
23
I/O
Two−Wire Serial data I/O
SADDR
24
Input
Two−Wire Serial address select. 0: 0x20. 1: 0x30
SCLK
25
Input
Two−Wire Serial clock input
RESET_BAR
26
Input
Asynchronous reset (active LOW). All settings are restored to factory default.
OE_BAR
27
Input
Output enable (active LOW)
TRIGGER
28
Input
Exposure synchronization input
SHUTTER
29
Output
Control for external mechanical shutter. Can be left floating if not used.
VAA_PIX
34, 38
Power
Pixel power, 2.8 V nominal
ATEST
36
Reserved, NC
SLVS3_P
44
Output
HiSPi serial data, lane 3, differential P
SLVS3_N
45
Output
HiSPi serial data, lane 3, differential N
SLVS2_P
46
Output
HiSPi serial data, lane 2, differential P
SLVS2_N
47
Output
HiSPi serial data, lane 2, differential N
SLVSC_P
48
Output
HiSPi serial DDR clock differential P
NOTE: The 36 thermal connection pads should be all soldered to DGND plane for better thermal conductivity. Refer to PACKAGE
DIMENSIONS for details..



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