SWIFT 数据表(PDF) - Amkor Technology

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SWIFT 数据表 (PDF) - Amkor Technology

SWIFT Datasheet PDF - Amkor Technology


部件名	SWIFT

下载	SWIFT 下载

文件大小	1342.31 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Silicon Wafer Integrated Fan-out Technology (SWIFT) is designed to provide increased I/O and circuit density in a reduced footprint and profile for single and multi-die applications.

SWIFT Datasheet (PDF)

Go To PDF Page

下载数据表

SWIFT Datasheet PDF - Amkor Technology


部件名	SWIFT

下载	SWIFT Click to download

文件大小	1342.31 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Silicon Wafer Integrated Fan-out Technology (SWIFT) is designed to provide increased I/O and circuit density in a reduced footprint and profile for single and multi-die applications.

SWIFT 数据表 (HTML) - Amkor Technology

SWIFT Datasheet HTML 1Page - Amkor Technology

SWIFT Datasheet HTML 2Page - Amkor Technology

SWIFT 产品详情

FEATURES
Polymer dielectrics
Multi-die and large die capability
Large body package capability
Interconnect density down to 2/2 μm
Cu pillar die interconnect down to 30 μm pitch
Meets JEDEC MSL2a and MSL3 CLR and BLR requirements

类似零件编号 - SWIFT

制造商	部件名	数据表	功能描述
Seoul Semiconductor	SWIFO111E	996Kb / 23P	Direct TV Application

类似说明 - SWIFT

制造商	部件名	数据表	功能描述
National Instruments Co...	NIPXI-7813R	377Kb / 17P	Integrated Analog and Digital I/O with FPGA Technology
National Instruments Co...	NIPXI7851R	377Kb / 17P	Integrated Analog and Digital I/O with FPGA Technology
E-Tech Electronics LTD	GS204U	152Kb / 2P	The GS204U is designed for bias circuit and protection circuit.
Amkor Technology	WLCSP	474Kb / 2P	Wafer Level Processing and Die Processing Services
Littelfuse	V05E50P	1Mb / 12P	Reduced footprint and volume required for surge protection
Delta Electronics, Inc.	Q36SR	713Kb / 14P	Industry standard footprint and pin out
Renesas Technology Corp	RJP30H2DPK-M0-11	159Kb / 6P	Trench gate and thin wafer technology
Delta Electronics, Inc.	FL75L10	522Kb / 7P	Industry standard footprint and pin-out
Delta Electronics, Inc.	S48SA05006	910Kb / 13P	Industry standard footprint and pin out
Shanghai Leiditech Elec...	L1000LVF	381Kb / 2P	Designed for use in line voltage applications and permitting

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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