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Page 15 of 15

Issue A

ML145053

LANSDALE Semiconductor, Inc.

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil-

ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-

tomer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.

SOG PACKAGE

(ML145053-5P)

CASE 751A-03

-A-

-B-

G

C

K

SEAT-

ING

PLANE

M

J

1

7

8

14

T

F

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982

2. CONTROLLING DIMENSION: MILLIMETER

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION

4. MAXIMUM HOLD PROTRUSION 0.15 (0.006) PER

SIDE

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN

EXCESS OF THE D DIMENSION AT MAXIMUM

MATERIAL CONDITION

DIM

INCHES

MILLIMETERS

MIN

MAX

MIN

MAX

A

8.55

8.75

0.337

0.334

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

G

1.27 BSC

0.050 BSC

0.049

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

P

5.80

6.20

0.228

0.244

R

0.25

0.50

0.010

0.019

M

0°

7°

0°

7°

0.25 (0.010)

B

M

0.25 (0.010)

B

A

M

S

S

M

OUTLINE DIMENSIONS