TLE2021MFKB datasheet(6/79 Pages) TI

部件名	TLE2021MFKB

功能描述	EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS

PDF	79 Pages

Scroll/Zoom	100%

制造商	TI [Texas Instruments]

网页	http://www.ti.com

标志

6 / 79 page

TLE202x, TLE202xA, TLE202xB, TLE202xY

EXCALIBUR HIGH-SPEED LOW-POWER PRECISION

OPERATIONAL AMPLIFIERS

SLOS191B – FEBRUARY 1997 – REVISED JANUARY 2002

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLE2024Y chip information

This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or

ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (11) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

–

1OUT

1IN +

1IN –

VCC +

(4)

(6)

(3)

(2)

(5)

(1)

–

(7)

2IN +

2IN –

2OUT

(11)

VCC – /GND

–

3OUT

2IN +

3IN –

(13)

(10)

(9)

(12)

(8)

–

(14)

4OUT

4IN +

4IN –

100

140

TLE2021MFKB 数据表(PDF) 6 Page - Texas Instruments

TLE2021MFKB 数据表(HTML) 6 Page - Texas Instruments

Html Pages

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