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TLE2021MFKB 数据表(PDF) 2 Page - Texas Instruments |
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TLE2021MFKB 数据表(HTML) 2 Page - Texas Instruments |
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2 / 79 page  TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS SLOS191B – FEBRUARY 1997 – REVISED JANUARY 2002 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA VIOmax AT 25 °C SMALL OUTLINE† (D) SSOP‡ (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP‡ (PW) CHIP FORM§ (Y) 0 °C to 200 µV TLE2021ACD TLE2021CDBLE TLE2021ACP — — 70 °C µ 500 µV TLE2021CD TLE2021CDBLE — — TLE2021CP TLE2021CPWLE TLE2021Y – 40 °C to 200 µV TLE2021AID TLE2021AIP to 85 °C µ 500 µV TLE2021ID — — — TLE2021AIP TLE2021IP — — – 55 °C 100 µV — TLE2021BMFK TLE2021BMJG — to µ 200 µV TLE2021AMD — TLE2021AMFK TLE2021AMJG TLE2021AMP — — 125 °C 500 µV TLE2021MD TLE2021MFK TLE2021MJG TLE2021MP † The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). ‡ The DB and PW packages are only available left-end taped and reeled. § Chip forms are tested at 25 °C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA VIOmax AT 25 °C SMALL OUTLINE† (D) SSOP‡ (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP‡ (PW) CHIP FORM§ (Y) 0 °C to 150 µV 300 µV TLE2022BCD TLE2022ACD — — TLE2022ACP — — — — to 70 °C 300 µV 500 µV TLE2022ACD TLE2022CD — TLE2022CDBLE — — TLE2022ACP TLE2022CP — TLE2022CPWLE — TLE2022Y – 40 °C to 150 µV 300 µV TLE2022BID TLE2022AID — TLE2022AIP to 85 °C 300 µV 500 µV TLE2022AID TLE2022ID — — — TLE2022AIP TLE2022IP — — – 55 °C 150 µV — — TLE2022BMJG — 55 C to 150 µV 300 µV TLE2022AMD — TLE2022AMFK TLE2022BMJG TLE2022AMJG TLE2022AMP — — 125 °C µ 500 µV TLE2022MD TLE2022MFK TLE2022MJG TLE2022MP † The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR). ‡ The DB and PW packages are only available left-end taped and reeled. § Chip forms are tested at 25 °C only. TLE2024 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA VIOmax AT 25 °C SMALL OUTLINE (DW) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) CHIP FORM§ (Y) 500 µV TLE2024BCDW TLE2024BCN — 0 °C to 70 °C 500 µV 750 µV TLE2024BCDW TLE2024ACDW — — TLE2024BCN TLE2024ACN — µ 1000 µV TLE2024CDW TLE2024CN TLE2024Y 500 µV TLE2024BIDW TLE2024BIN – 40 °C to 85°C 500 µV 750 µV TLE2024BIDW TLE2024AIDW — — TLE2024BIN TLE2024AIN — µ 1000 µV TLE2024IDW TLE2024IN 500 µV TLE2024BMDW TLE2024BMFK TLE2024BMJ TLE2024BMN – 55 °C to 125°C µ 750 µV TLE2024AMDW TLE2024AMFK TLE2024AMJ TLE2024AMN — 1000 µV TLE2024MDW TLE2024MFK TLE2024MJ TLE2024MN § Chip forms are tested at 25 °C only. |
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