TLE2021MFKB datasheet(72/79 Pages) TI

72 / 79 page

MECHANICAL DATA

MLCC006B – OCTOBER 1996

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

FK (S-CQCC-N**)

LEADLESS CERAMIC CHIP CARRIER

4040140 / D 10/96

28 TERMINAL SHOWN

0.358

(9,09)

MAX

(11,63)

0.560

(14,22)

0.560

0.458

0.858

(21,8)

1.063

(27,0)

(14,22)

NO. OF

MIN

MAX

0.358

0.660

0.761

0.458

0.342

(8,69)

MIN

(11,23)

(16,26)

0.640

0.739

0.442

(9,09)

(11,63)

(16,76)

0.962

1.165

(23,83)

0.938

(28,99)

1.141

(24,43)

(29,59)

(19,32)

(18,78)

0.020 (0,51)

TERMINALS

0.080 (2,03)

0.064 (1,63)

(7,80)

0.307

(10,31)

0.406

(12,58)

0.495

(12,58)

0.495

(21,6)

0.850

(26,6)

1.047

0.045 (1,14)

0.035 (0,89)

0.010 (0,25)

0.020 (0,51)

0.010 (0,25)

B SQ

A SQ

0.055 (1,40)

0.045 (1,14)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

TLE2021MFKB 数据表(PDF) 72 Page - Texas Instruments

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