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MB91F525FHDPMC 数据表(PDF) 40 Page - Cypress Semiconductor

部件名 MB91F525FHDPMC
功能描述  32-bit FR81S Microcontroller
PDF  280 Pages
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制造商  CYPRESS [Cypress Semiconductor]
网页  http://www.cypress.com
标志 CYPRESS - Cypress Semiconductor

MB91F525FHDPMC 数据表(HTML) 40 Page - Cypress Semiconductor

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Document Number: 002-04662 Rev. *F
Page 40 of 280
MB91520 Series
5.
Handling Precautions
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the
conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that
must be observed to minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor
devices.
1. Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
 Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in
excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.
 Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical
characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may
adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users
considering application outside the listed conditions are advised to contact their sales representative beforehand.
 Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to power supply and
input/output functions.
(1) Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the
device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or
over-current conditions at the design stage.
(2) Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current
flows. Such conditions if present for extended periods of time can damage the device.
Therefore, avoid this type of connection.
(3) Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should
be connected through an appropriate resistance to a power supply pin or ground pin.
 Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to
abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large
current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called
latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury
or damage from high heat, smoke or flame. To prevent this from happening, do the following:
(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to
abnormal noise, surge levels, etc.
(2) Be sure that abnormal current flows do not occur during the power-on sequence.



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