MB91F525FHDPMC datasheet(41/280 Pages) CYPRESS

41 / 280 page

Document Number: 002-04662 Rev. *F

Page 41 of 280

MB91520 Series

 Observance of Safety Regulations and Standards

Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic

interference, etc. Customers are requested to observe applicable regulations and standards in the design of products.

 Fail-Safe Design

Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from

such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection,

and prevention of over-current levels and other abnormal operating conditions.

 Precautions Related to Usage of Devices

Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other

office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).

CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may

directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are

demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical

devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be

responsible for damages arising from such use without prior approval.

2. Precautions for Package Mounting

Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during

soldering, you should only mount under Cypress's recommended conditions. For detailed information about mount

conditions, contact your sales representative.

 Lead Insertion Type

Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the

board, or mounting by using a socket.

Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the

flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to

be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should

conform to Cypress recommended mounting conditions.

If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact

deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC

leads be verified before mounting.

 Surface Mount Type

Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily

deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to

open connections caused by deformed pins, or shorting due to solder bridges.

You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a

ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress

ranking of recommended conditions.

 Lead-Free Packaging

CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering,

junction strength may be reduced under some conditions of use.

 Storage of Semiconductor Devices

Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause

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