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LTC3113 数据表(PDF) 7 Page - Linear Technology |
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LTC3113 数据表(HTML) 7 Page - Linear Technology |
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7 / 24 page ![]() LTC3113 7 3113f PIN FUNCTIONS VOUT (Pins 1, 2/Pins 2, 3): Buck-Boost Output Voltage. A low ESR capacitor should be placed from VOUT to PGND. The capacitor should be placed as close to the IC as pos- sible and have a short return path to ground. VIN (Pins 3, 4, 5/Pins 4, 5, 6): Power Input for the Converter. A 47μF or larger bypass capacitor should be connected between VIN and PGND. The bypass capacitor should located as close to VIN and PGND as possible and should via directly to the ground plane. SGND (Pin 6/Pin 7): Signal Ground. Terminate the fre- quency setting resistor and output voltage divider to SGND. BURST (Pin 7/Pin 8): Pulse Width Modulation/Burst Mode Selection Input. Forcing this pin low causes the switching converter to operate in low noise fixed frequency PWM mode. Forcing this pin high enables constant Burst Mode operation for the converter. During Burst Mode operation, the converter can only support a reduced maximum load current. RT (Pin 8/Pin 9): Programs the Frequency of the Internal Oscillator. Connect a resistor from RT to ground (SGND). The RT resistor value for a given frequency is given by the following equation. R T ≅ 90 fMHz () k Ω () VC (Pin 9/Pin 12): Error Amp Output. An R-C network is connected from this pin to FB for loop compensation. Refer to the Closing the Feedback Loop section for component selection guidelines. FB (Pin 10/Pin 13): Feedback Voltage for the Buck-Boost Converter Derived from a Resistor Divider on the Buck- Boost Output Voltage. The buck-boost output voltage is given by the following equation: V OUT = 0.600 1+ R2 R1 ⎛ ⎝⎜ ⎞ ⎠⎟ V () where R1 is a resistor connected between FB and SGND, and R2 is a resistor connected between FB and VOUT. The buck-boost output voltage can be adjusted from 1.8V to 5.5V. RUN (Pin 11/Pin 14): Active High Converter Enable In- put. Applying a voltage <0.3V to this pin shuts down the LTC3113. Applying a voltage >1.2V to this pin enables the LTC3113. SW1 (Pins 12, 13, 14/Pins 15, 16, 17): Switch Pin Where Internal Switches A and B are Connected. Connect the inductor from SW1 to SW2. Minimize trace length to reduce EMI. SW2 (Pins 15, 16/Pins 18, 19): Switch Pin Where Internal Switches C and D are Connected. Connect the inductor from SW1 to SW2. Minimize trace length to reduce EMI. PGND (Exposed Pad Pin 17/Pins 1, 10, 11, 20, Exposed Pad Pin 21): The exposed pad must be soldered to the PCB and electrically connected to ground through the shortest and lowest impedance connection possible. In most applications the bulk of the heat flow out of the LTC3113 is through this pad, so printed circuit board design has an impact on the thermal performance of the part. See the PCB Layout and Thermal Considerations section for more details. (DFN/TSSOP) |
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