LTC3113 datasheet(16/24 Pages) LINER

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LTC3113

3113f

it is incumbent upon the user to verify proper operation

over the intended system’s line, load and environmental

operating conditions.

The junction-to-air (

θJA)andjunction-to-case(θJC)thermal

resistance given in the “Pin Conﬁguration” diagram may

also be used to estimate the LTC3113 internal temperature.

These thermal coefﬁcients are determined using a 4-layer

PCB. Bear in mind that the actual thermal resistance of

the LTC3113 to the printed circuit board depends upon

the design of the circuit board.

The die temperature of the LTC3113 must be lower than

the maximum rating of 125°C, so care should be taken in

the layout of the circuit board to ensure good heat sinking

of the LTC3113. The bulk of the heat ﬂow is through the

bottom exposed pad of the part into the printed circuit board.

Consequently, a poor printed circuit board design can cause

excessive heating, resulting in impaired performance or

reliability. Refer to the PCB Layout Considerations section

for printed circuit board design suggestions.

As described in the Thermal Shutdown section, the

LTC3113 is equipped with a thermal shutdown circuit that

will inhibit power switching at high junction temperatures.

The activation threshold of this function, however, is

above the 125°C rating to avoid interfering with normal

operation. Thus, it follows that prolonged or repetitive

operation under a condition in which the thermal shutdown

activates necessarily means that the die is subjected to

temperatures above the 125°C rating for prolonged or

repetitive intervals, which may damage or impair the

reliability of the device.

Figure 3c. Top Layer of Example PCB

Figure 3d. Bottom Layer of Example PCB

THERMAL AND

PGND VIAS

APPLICATIONS INFORMATION

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