AD8375

Data Sheet

Rev. B | Page 6 of 24

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

VCOM

VIN+

VIN–

A4

A3

A2

VOUT+

VOUT–

VOUT+

VOUT–

COMM

VPOS

NOTES

1. THE EXPOSED PAD IS INTERNALLY CONNECTED TO GROUND.

SOLDER TO A LOW IMPEDANCE GROUND PLANE.

2

1

3

4

5

6

18

17

16

15

14

13

AD8375

TOP VIEW

(Not to Scale)

Figure 3. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

VCOM

Common-Mode Pin. Typically bypassed to ground using external capacitor.

2

VIN+

Voltage Input Positive.

3

VIN−

Voltage Input Negative.

4

A4

MSB for the 5-Bit Gain Control Interface.

5

A3

MSB − 1 for the Gain Control Interface.

6

A2

MSB − 2 for the Gain Control Interface.

7

A1

LSB + 1 for the Gain Control Interface.

8

A0

LSB for the 5-Bit Gain Control Interface.

9, 10, 12, 13, 23

VPOS

Positive Supply Pins. Should be bypassed to ground using suitable bypass capacitor.

11, 14, 20, 21, 22, 24

COMM

Device Common (DC Ground).

15, 17

VOUT+

Positive Output Pins (Open Collector). Require dc bias of +5 V nominal.

16, 18

VOUT−

Negative Output Pins (Open Collector). Require dc bias of +5 V nominal.

19

PWUP

Chip Enable Pin. Enabled with a logic high and disabled with a logic low.

EPAD

Exposed Pad. The Exposed Pad is internally connected to ground. Solder to a low impedance

ground plane.