AD8375ACPZ-R7 datasheet(22/24 Pages) AD

22 / 24 page

AD8375

Data Sheet

Rev. B | Page 22 of 24

OUTLINE DIMENSIONS

0.30

0.25

0.20

0.80

0.75

0.70

0.25 MIN

2.20

2.10 SQ

2.00

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8.

BOTTOM VIEW

TOP VIEW

SIDE VIEW

4.10

4.00 SQ

3.90

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 51. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8375ACPZ-WP

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP], Waffle Pack

CP-24-10

AD8375ACPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP], 7”Tape and Reel

CP-24-10

AD8375-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

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