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REF2025 数据表(PDF) 2 Page - Texas Instruments |
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REF2025 数据表(HTML) 2 Page - Texas Instruments |
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2 / 33 page ![]() 2 REF2025, REF2030, REF2033, REF2041 SBOS600C – MAY 2014 – REVISED JANUARY 2017 www.ti.com Product Folder Links: REF2025 REF2030 REF2033 REF2041 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Device Comparison Table..................................... 3 6 Pin Configuration and Functions ......................... 3 7 Specifications......................................................... 4 7.1 Absolute Maximum Ratings ...................................... 4 7.2 ESD Ratings.............................................................. 4 7.3 Recommended Operating Conditions ....................... 4 7.4 Thermal Information .................................................. 4 7.5 Electrical Characteristics.......................................... 5 7.6 Typical Characteristics .............................................. 6 8 Parameter Measurement Information ................ 13 8.1 Solder Heat Shift ..................................................... 13 8.2 Thermal Hysteresis ................................................. 14 8.3 Noise Performance ................................................. 15 9 Detailed Description ............................................ 16 9.1 Overview ................................................................. 16 9.2 Functional Block Diagram ....................................... 16 9.3 Feature Description................................................. 16 9.4 Device Functional Modes........................................ 17 10 Applications and Implementation...................... 18 10.1 Application Information.......................................... 18 10.2 Typical Application ................................................ 18 11 Power-Supply Recommendations ..................... 23 12 Layout................................................................... 24 12.1 Layout Guidelines ................................................. 24 12.2 Layout Example .................................................... 24 13 Device and Documentation Support ................. 25 13.1 Documentation Support ........................................ 25 13.2 Related Links ........................................................ 25 13.3 Receiving Notification of Documentation Updates 25 13.4 Community Resources.......................................... 25 13.5 Trademarks ........................................................... 25 13.6 Electrostatic Discharge Caution ............................ 25 13.7 Glossary ................................................................ 25 14 Mechanical, Packaging, and Orderable Information ........................................................... 26 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (July 2014) to Revision C Page • Added I/O column to Pin Functions table .............................................................................................................................. 3 • Added Storage temperature parameter to Absolute Maximum Ratings table (moved from ESD Ratings table)................... 4 • Changed ESD Rating table: changed title, updated table format .......................................................................................... 4 Changes from Revision A (June 2014) to Revision B Page • Changed device status to Production Data from Mixed Status ............................................................................................. 1 • Deleted footnote 2 from Device Information table ................................................................................................................. 1 • Deleted footnote from Device Comparison Table ................................................................................................................. 3 • Added Thermal Information table ........................................................................................................................................... 4 Changes from Original (May 2014) to Revision A Page • Made changes to product preview data sheet........................................................................................................................ 1 |
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