0

10

20

30

40

50

-0.0125

-0.01

-0.0075 -0.005 -0.0025

0

0.0025

Solder Heat Shift Histogram - V

C041

0

10

20

30

40

50

60

-0.0125

-0.01

-0.0075 -0.005 -0.0025

0

0.0025

Solder Heat Shift Histogram - V

C040

0

50

100

150

200

250

300

0

50

100

150

200

250

300

350

400

Time (seconds)

C01

13

REF2025, REF2030, REF2033, REF2041

www.ti.com

SBOS600C – MAY 2014 – REVISED JANUARY 2017

Product Folder Links: REF2025 REF2030 REF2033 REF2041

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Copyright © 2014–2017, Texas Instruments Incorporated

8 Parameter Measurement Information

8.1 Solder Heat Shift

The materials used in the manufacture of the REF20xx have differing coefficients of thermal expansion, resulting

in stress on the device die when the part is heated. Mechanical and thermal stress on the device die can cause

the output voltages to shift, degrading the initial accuracy specifications of the product. Reflow soldering is a

common cause of this error.

In order to illustrate this effect, a total of 92 devices were soldered on four printed circuit boards [23 devices on

each printed circuit board (PCB)] using lead-free solder paste and the paste manufacturer suggested reflow

profile. The reflow profile is as shown in Figure 40. The printed circuit board is comprised of FR4 material. The

board thickness is 1.57 mm and the area is 171.54 mm × 165.1 mm.

The reference and bias output voltages are measured before and after the reflow process; the typical shift is

displayed in Figure 41 and Figure 42. Although all tested units exhibit very low shifts (< 0.01%), higher shifts are

also possible depending on the size, thickness, and material of the printed circuit board. An important note is that

the histograms display the typical shift for exposure to a single reflow profile. Exposure to multiple reflows, as is

common on PCBs with surface-mount components on both sides, causes additional shifts in the output bias

voltage. If the PCB is exposed to multiple reflows, the device should be soldered in the second pass to minimize

its exposure to thermal stress.

Figure 40. Reflow Profile