4

REF2025, REF2030, REF2033, REF2041

SBOS600C – MAY 2014 – REVISED JANUARY 2017

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Product Folder Links: REF2025 REF2030 REF2033 REF2041

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Copyright © 2014–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

EN

–0.3

Temperature

Operating

–55

150

°C

150

–65

170

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

±1500

(1)

See Figure 28 in Typical Characteristics for minimum input voltage at different load currents and temperature

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

(1)

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

REF20xx

UNIT

DDC (SOT23)

5 PINS

Junction-to-ambient thermal resistance

193.6

°C/W

Junction-to-case (top) thermal resistance

40.2

°C/W

Junction-to-board thermal resistance

34.5

°C/W

Junction-to-top characterization parameter

0.9

°C/W

Junction-to-board characterization parameter

34.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W