ADL5519ACPZ-R7 datasheet(39/39 Pages) AD

39 / 39 page

Data Sheet

ADL5519

Rev. B | Page 39 of 39

OUTLINE DIMENSIONS

0.50

0.40

0.30

2.85

2.70 SQ

2.55

0.50

BSC

PIN 1

INDICATOR

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

0.25 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-2

3.50 REF

BOTTOM VIEW

TOP VIEW

SEATING

PLANE

EXPOSED

PAD

END VIEW

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 77. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-21)

Dimensions shown in millimeters

ORDERING GUIDE

Model1,2

Temperature Range

Package Description

Package Option

ADL5519ACPZ-R7

−40°C to +125°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-21

ADL5519ACPZ-R2

−40°C to +125°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-21

ADL5519ACPZ-WP

−40°C to +125°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-21

ADL5519-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

WP = waffle pack.

registered trademarks are the property of their respective owners.

D06198-0-9/17(B)

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