AD8337BCPZ-R2 datasheet(28/28 Pages) AD

28 / 28 page

AD8337

Data Sheet

Rev. D | Page 28 of 28

OUTLINE DIMENSIONS

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

PIN 1

INDICATOR

(R 0.15)

Figure 94. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

AD8337BCPZ-R2

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

HVB

AD8337BCPZ-REEL

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

HVB

AD8337BCPZ-REEL7

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

HVB

AD8337BCPZ-WP

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

HVB

AD8337-EVALZ

Evaluation Board with Noninverting Gain Configuration

AD8337-EVALZ-INV

Evaluation Board with Inverting Gain Configuration

AD8337-EVALZ-SS

Evaluation Board with Single-Supply Operation

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D05575-0-10/16(D)

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