AD8337BCPZ-R2 datasheet(25/28 Pages) AD

25 / 28 page

Data Sheet

AD8337

Rev. D | Page 25 of 28

POWER SUPPLY

+5V

TOP:

SIGNAL GENERATOR 10.05MHz, 500mV p-p

BOTTOM:

SIGNAL GENERATOR 9.95MHz, 500mV p-p

SIGNAL

INPUT

–5V

POWER

SPLITTER

PREAMP

OUTPUT

VGAIN

POWER

AMPLIFIERS

SPECTRUM

ANALYZER

Figure 83. Typical Board Test Connections

MEASUREMENT SETUP

Figure 83 shows board connections for two generators. In this

example, the experiment illustrates IMD measurements using

standard off-the-shelf test equipment used by Analog Devices.

However, any equivalent equipment can be used.

BOARD LAYOUT CONSIDERATIONS

The AD8337 evaluation board is designed using four layers.

Interconnecting circuitry is located on the component and

wiring sides, with the inner layers dedicated to power and

ground planes. Figure 84 through Figure 88 show the copper

layouts.

For ease of assembly, all board components are located on the

primary side and are 0603 size surface mounts. Higher density

applications may require components on both sides of the board

and present no problem to the AD8337, as demonstrated in

unreleased versions of the board that featured secondary-side

components and vias. Not evident in the figures are thermal

vias within the pad that solder to the mating pad of the AD8337

chip-scale package. These vias serve as a thermal path and are

the primary means of removing heat from the device. The thermal

specifications for the AD8337 are predicated on the use of multi-

layer board construction with these thermal vias to enable heat

conductivity from the die.

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