Data Sheet

ADAU7002

Rev. B | Page 13 of 16

OUTLINE DIMENSIONS

A

B

C

D

0.560

0.500

0.440

0.230

0.200

0.170

0.330

0.300

0.270

0.800

0.760

0.720

1.600

1.560

1.520

1

2

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.300

0.260

0.220

1.20

REF

0.40

BSC

0.40 BSC

BALL A1

IDENTIFIER

ORIENTATION

IDENTIFIER

SEATING

PLANE

COPLANARITY

0.05

Figure 22. 8-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-8-6)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package

Option

Branding

ADAU7002ACBZ-R7

−40°C to +85°C

8-Ball Wafer Level Chip Scale Package [WLCSP], 7”Tape and Reel

CB-8-6

BE

ADAU7002ACBZ-RL

−40°C to +85°C

8-Ball Wafer Level Chip Scale Package [WLCSP], 13”Tape and Reel

CB-8-6

BE

EVAL-ADAU7002Z

Evaluation Board