SSM6322

Data Sheet

Rev. 0 | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

Single Supply

12.6 V

Dual Supply

±6.3 V

Exposed Pad Voltage

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to + 85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and

operating environment. Careful attention to PCB thermal

design is required. The values in Table 4 were obtained per

JEDEC standard JESD51-12.

Table 4. Thermal Resistance

Package Type

Unit

CP-24-15

47

3.3

°C/W

value can be achieved.

Although the exposed pad can be left floating, it must be connected

to an external V− plane or ground plane for proper thermal

management.

Maximum Power Dissipation

The maximum safe power dissipation for the SSM6322 is limited

approximately 150C, which is the glass transition temperature,

the properties of the plastic change. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the SSM6322. Exceeding a junction temperature of 175C

for an extended period can result in changes in silicon devices,

potentially causing degradation or loss of functionality. The power

dissipation and the power dissipated in the die due to the

SSM6322 drive at the output.



L

2

OUT

L

OUT

S

S

S

D

R

V

–

R

V

2

V

I

V

P





















the rms signal levels are indeterminate, consider the worst case,

 



L

S

S

S

D

R

/

V

I

V

P

2

4







Also, more metal directly in contact with the package leads and

exposed paddle from metal traces, through holes, ground, and

Figure 2 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 24-lead LFCSP

package on a JEDEC standard 4-layer board.

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

–40

–25

–10

5

20

35

50

65

80

AMBIENT TEMPERATURE (°C)

Figure 2. Maximum Power Dissipation vs. Ambient Temperature for a

4-Layer Board

ESD CAUTION