SSM6322

Data Sheet

Rev. 0 | Page 20 of 20

OUTLINE DIMENSIONS

0.80

0.75

0.70

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

0.30

0.25

0.18

0.20 MIN

2.70

2.60 SQ

2.50

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 49. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-15)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Package

Package Description

Package Option

Branding

SSM6322ACPZ-R2

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-15

6322A

SSM6322ACPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-15

6322A

SSM6322ACPZ-RL

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-15

6322A

SSM6322CP-EBZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D15260-0-3/17(0)