MHT2012N

13

RF Device Data

NXP Semiconductors

PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS

Refer to the resources to aid your design process.

Application Notes

 AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages

 AN1955: Thermal Measurement Methodology of RF Power Amplifiers

Engineering Bulletins

 EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

 Electromigration MTTF Calculator

 RF High Power Model

Development Tools

 Printed Circuit Boards

To Download Resources Specific to a Given Part Number:

2. Search by part number

3. Click part number link

4. Choose the desired resource from the drop down menu

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

July 2018

 Initial release of data sheet