S72XS-R MCP

Document Number: 002-00772 Rev. *J

Page 4 of 7

Ordering Information

The order number (Valid Combination) is formed by the following:

Valid Combinations

Valid combinations in Table 5 list the configurations planned to be supported in volume for this device. Contact your local sales

office to confirm the availability of specific valid combinations and to check on newly released combinations.

Electronic Serial Number

For applicable devices, the Factory Secured Silicon Area contains a random, 128-bit ESN, stored in the address range

000000h-000007h.

Notes

3. Packing Type 0 is standard. Specify other options as required.

4. BGA package marking omits leading “S” and packing type designator from ordering part number.

S72XS

256

R

E0

AH

B

HE

3

Packing Type

0 = Tray

3 = 13-inch Tape and Reel

Model Number

See Valid Combinations (Table 5)

Package Modifier

B = 133-ball, 8x8 mm, FBGA MCP

Package and Material Type

AH = Thin profile Fine-pitch BGA Pb-free Low-Halogen MCP (0.5 mm pitch)

DDR DRAM and Data Flash Density

E0 = 256 Mb DDR, No Data Flash

Process Technology

R = 65 nm, MirrorBit

Code Flash Density

256 = 256 Mb

Product Family

S72XS Multi-Chip Product (MCP)

1.8V Address-High, Address-Low, Data Multiplexed, SRW, Burst Mode Flash and DDR

DRAM on Split Bus

Table 5. Valid Combinations

Base OPN

[4]

Package

Model

Number

Packing

Type

[3, 4]

Flash

Boot

Temperature

Range

Electronic

Serial

Number

Flash

Density

DDR

DRAM

Density

Flash

Speed

(MHz)

DRAM

Speed

(MHz)

DRAM

Specification

Package

S72XS256RE0

AHB

H1

0, 3

Top

Wireless

Yes

256 Mb

256 Mb

108

166

SDM256D166

D1R

8.0

 8.0 mm

133-ball MCP

(RSC133)

J1

Bottom

No

SDM256D166

D3R

HH

Top

Industrial

Yes

JH

Bottom

H2

Top

J2

Bottom