AD8139

Rev. A | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

12 V

Power Dissipation

See Figure 3

Input Common-Mode Voltage

Storage Temperature

–65°C to +125°C

Operating Temperature Range

–40°C to +125°C

Lead Temperature Range

(Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress rat-

ing only; functional operation of the device at these or any

other conditions above those indicated in the operational sec-

tion of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

for device soldered in circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

SOIC-8 with EP/4-Layer

70

°C/W

LFCSP/4-Layer

70

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8139 package is

die. At approximately 150°C, which is the glass transition tem-

perature, the plastic will change its properties. Even temporarily

exceeding this temperature limit may change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the AD8139. Exceeding a junction temperature of

175°C for an extended period of time can result in changes in the

silicon devices potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

and common-mode currents flowing to the load, as well as

currents flowing through the external feedback networks and

the internal common-mode feedback loop. The internal resistor

tap used in the common-mode feedback loop places a 1 kΩ

differential load on the output. RMS output voltages should be

considered when dealing with ac signals.

the package leads from metal traces, through holes, ground, and

Figure 3 shows the maximum safe power dissipation in the

package versus the ambient temperature for the exposed paddle

approximations.

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

–40

–20

0

20

40

60

80

100

120

AMBIENT TEMPERATURE (

°C)

SOIC

AND LFCSP

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.