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MAS6181B 数据表(PDF) 7 Page - Micro Analog systems |
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MAS6181B 数据表(HTML) 7 Page - Micro Analog systems |
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7 / 14 page ![]() 7 (14) DA6181B.003 17 September, 2014 TYPICAL APPLICATION (Continued) Note 1: Crystals The crystals as well as ferrite antenna frequencies are chosen according to the time signal system (Table 2). The reason why the crystal frequency is about 3 Hz higher than the signal frequency is that the crystal is operated without the loading capacitor. Without loading capacitor the actual resonance frequency is about 3 Hz lower than with load thus 77.503 kHz crystal resonates at 77.500 kHz when no loading capacitor is used. Table 2. Time Signal System Frequencies Time Signal System Location Antenna Frequency Recommended Crystal Frequency DCF77 Germany 77.5 kHz 77.503 Hz HBG Switzerland 75 kHz 75.003 kHz MSF United Kingdom 60 kHz 60.003 kHz WWVB USA 60 kHz 60.003 kHz JJY Japan 40 kHz and 60 kHz 40.003 kHz and 60.003 kHz BPC China 68.5 kHz 68.505 kHz The parasitic shunt capacitance C0 of the two crystals should be as similar to each other as possible since they are used to cancel each other. Large shunt capacitance mismatch between the two crystals can lead to non- ideal filter characteristics and wide noise band-width. Effectively this means lower sensitivity performance. It should be noted that grounded crystal package has reduced shunt capacitance. This value is about 85% of floating crystal shunt capacitance. For example crystal with 1pF floating package shunt capacitance can have 0.85pF grounded package shunt capacitance. PCB traces of crystal and external compensation capacitance should be kept at minimum to minimize additional parasitic capacitance which can cause capacitance mismatching. When using MAS6181B1 it does not matter which of the two frequency crystals is connected to QO1 pin and which to QO2 pin. Table 3 below presents some crystal suppliers having suitable crystals for time signal receiver application. Table 3. Crystal Suppliers and Crystal Types in Alphabetical Order for Time Signal Receiver Application Supplier Crystal Type Dimensions Web Link Citizen CFV-206 ø 2.0 x 6.0 http://www.citizen.co.jp/tokuhan/quartz/ Epson Toyocom C-2-Type C-4-Type ø 1.5 x 5.0 ø 2.0 x 6.0 http://www.epsontoyocom.co.jp/english/ KDS Daishinku DT-261 ø 2.0 x 6.0 http://www.kds.info/index_en.htm Microcrystal MS3V-T1R 1.45 x 1.45 x 6.7 http://www.microcrystal.com/ Seiko Instruments VTC-120 ø 1.2 x 4.7 http://www.sii-crystal.com Note 2: AGC Capacitor The 10µF AGC and 47nF DEC capacitors must have low leakage currents due to very small signal currents through the capacitors. The insulation resistance of these capacitors should be at minimum several 100 MΩ. Also probes with at least several 100 MΩ impedance should be used for voltage probing of the AGC and DEC pins to not disturb their operation. Tantalum capacitors have lower leakage than the electrolyte capacitors. In case of using electrolyte type AGC capacitor the capacitor voltage rating should be at least 25 V for sufficiently low leakage. The DEC capacitor can be low leakage chip capacitor since its capacitance value is small. It is recommended to connect both AGC and DEC capacitors to VDD (see application figures 1 and 2) although VSS connection is also possible. The VDD connection provides better supply noise immunity because the signals and AGC gain are referenced to VDD. Additionally leakage currents are minimized in this connection because in power down the AGC pin voltage is pulled to VDD (to minimum AGC gain) providing zero voltage over the AGC capacitor. |
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