14 (14)

DA6181B.003

17 September, 2014

ORDERING INFORMATION

Product Code

Product

Description

MAS6181B1TC00

Dual Band AM-Receiver IC with

Differential Input

EWS-tested wafer, diameter 8”,

thickness 395 µm ± 5%.

MAS6181B1UC06

Dual Band AM-Receiver IC with

Differential Input

TSSOP-16, Pb-free, RoHS compliant, Tape &

Reel

Contact Micro Analog Systems Oy for other wafer thickness options.

N The formation of product code

An example for MAS6181B1TC00:

MAS6181

B

1

TC

00

Product

name

Design

version

Capacitance option:

Package type:

TC = 400 µm thick EWS tested wafer

Delivery format:

00 = undiced wafer

05 = dies on tray

06 = tape & reel

08 = in tube

LOCAL DISTRIBUTOR

MICRO ANALOG SYSTEMS OY CONTACTS

Micro Analog Systems Oy

Kutomotie 16

FI-00380 Helsinki, FINLAND

Tel. Int. +358 10 835 1100

Telefax +358 10 835 1119

http://www.mas-oy.com

NOTICE

Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or

performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits

shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no

claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and

Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or

modification.