18 (20)

DA6116.010

5 October, 2017

SO-16 PACKAGE OUTLINE

All dimensions are in accordance with JEDEC standard MS-013.

SOLDERING INFORMATION

 For Lead-Free / Green

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20

Maximum Temperature

260

C

Maximum Number of Reflow Cycles

3

Reflow profile

Thermal profile parameters stated in IPC/JEDEC J-STD-020

should not be exceeded. http://www.jedec.org

Lead Finish

Solder plate 7.62 - 25.4 µm, material Matte Tin

 Rework guideline

According to JEDEC standard J-STD-020C the moisture sensitivity level (MSL) 3 package SO-16 can withstand

maximum 260

C peak temperature for 20-40 seconds. The replacement part needs to be installed within 168

hours after opening of the moisture barrier bag or otherwise the part needs to be re-baked.

PLANE

SEATING

5° TYP.

10.50

10.10

PIN 1

1.27

TYP.

0.36

0.48

5°TYP

0.33 x 45°

0.86 TYP.

16 LEAD SO OUTLINE (300 MIL BODY)

0-0.13

RAD.

5° TYP.

5° TYP.

5° TYP.

0.25 RAD.

MIN.