SM7323EHKP

www.sinopowersemi.com

16

Copyright ã Sinopower Semiconductor, Inc.

Rev. A.1 - February, 2017

®

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm

3

<350

Volume mm

3

350-2000

Volume mm

3

>2000

<1.6 mm

260

°C

260

°C

260

°C

1.6 mm – 2.5 mm

260

°C

250

°C

245

°C

³2.5 mm

250

°C

245

°C

245

°C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm

3

<350

Volume mm

3

³350

<2.5 mm

235

°C

220

°C

³2.5 mm

220

°C

220

°C

Test item

Method

Description

SOLDERABILITY

JESD-22, B102

5 Sec, 245

°C

HTRB

JESD-22, A108

1000 Hrs, 80% of VDS max @ Tjmax

HTGB

JESD-22, A108

1000 Hrs, 100% of VGS max @ Tjmax

PCT

JESD-22, A102

168 Hrs, 100

%RH, 2atm, 121°C

TCT

JESD-22, A104

500 Cycles, -65

°C~150°C

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Preheat & Soak

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-120 seconds

Average ramp-up rate

3

°C/second max.

3

°C/second max.

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak package body Temperature

See Classification Temp in table 1

See Classification Temp in table 2

20** seconds

30** seconds

6

°C/second max.

6

°C/second max.

Time 25

°C to peak temperature

6 minutes max.

8 minutes max.

Classification Reflow Profiles

Customer Service

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5F, No. 6, Dusing 1St Rd., Hsinchu Science Park,

Hsinchu, 30078, Taiwan

TEL: 886-3-5635818

Fax: 886-3-5635080

Reliability Test Program