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SM7323EHKP 数据表(PDF) 2 Page - Sinopower Semiconductor Inc |
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SM7323EHKP 数据表(HTML) 2 Page - Sinopower Semiconductor Inc |
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2 / 16 page ![]() SM7323EHKP www.sinopowersemi.com 2 Copyright ã Sinopower Semiconductor, Inc. Rev. A.1 - February, 2017 ® Symbol Parameter Channel 1 Channel 2 Unit Common Ratings VDSS Drain-Source Voltage 30 V VGSS Gate-Source Voltage ±20 ±20 V TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -55 to 150 °C IS Diode Continuous Forward Current 15 18 A ID Continuous Drain Current TC=25°C 25 a 27 a A TC=100°C 25 a 27 a PD Maximum Power Dissipation TC=25°C 20 25 W TC=100°C 8 10 RqJC Thermal Resistance-Junction to Case Steady State 6 5 °C/W ID Continuous Drain Current TA=25°C 9.9 11.8 A TA=70°C 7.9 9.4 IDM b Pulse Drain Current TA=25°C 40 47 A PD Maximum Power Dissipation TA=25°C 1.13 1.3 W TA=70°C 0.72 0.83 RqJA c Thermal Resistance-Junction to Ambient t £ 10s 54 48 °C/W Steady State 110 96 IAS d Avalanche Current, Single pulse L=0.1mH 16 20 A EAS d Avalanche Energy, Single pulse L=0.1mH 12.8 20 mJ Note a:Max. continuous current is limited by bonding wire. Note b:Pulse width is limited by max. junction temperature. Note c:Surface mounted on 1in 2 pad area, steady state t=999s. Note d:UIS tested and pulse width are limited by maximum junction temperature 150 oC (initial temperature Tj=25oC). Absolute Maximum Ratings (T A = 25°C unless otherwise noted) |
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