MPC859TZP133 datasheet(88/92 Pages) FREESCALE

部件名	MPC859TZP133

功能描述	Hardware Specifications

PDF	92 Pages

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制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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MPC866/859 Hardware Speciﬁcations

MOTOROLA

Document Revision History

Table 40 lists signiﬁcant changes between revisions of this document.

Table 40. Document Revision History

Revision

Number

Date

Substantive Changes

5/2002

Initial revision

11/2002

Added the 5-V tolerant pins, new package dimensions, and other changes.

1.1

4/2003

Added the Spec. B1d and changed spec. B1a. Added the Note Solder sphere

composition for MPC866XZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb

2%Ag to Figure 15-79.

1.2

4/2003

Added the MPC859P.

1.3

5/2003

Changed the SPI Master Timing Specs. 162 and 164.

1.4

7-8/2003

• Added TxClav and RxClav to PB15 and PC15. Changed B28a through B28d and

B29b to show that TRLX can be 0 or 1.

• Added nontechnical reformatting.

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MPC859TZP133 数据表(PDF) 88 Page - Freescale Semiconductor, Inc