MPC859TZP133 datasheet(14/92 Pages) FREESCALE

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MPC866/859 Hardware Speciﬁcations

MOTOROLA

Power Supply and Power Sequencing

7.5

Experimental Determination

To determine the junction temperature of the device in the application after prototypes are available, the

thermal characterization parameter (

ΨJT) can be used to determine the junction temperature with a

measurement of the temperature at the top center of the package case using the following equation:

TJ = TT +(ΨJT x PD)

where:

JT = thermal characterization parameter

TT = thermocouple temperature on top of package

PD = power dissipation in package

The thermal characterization parameter is measured per JESD51-2 speciﬁcation published by JEDEC using

a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be

positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over

the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire

is placed ﬂat against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

7.6

References

Semiconductor Equipment and Materials International

(415) 964-5111

805 East Middleﬁeld Rd.

Mountain View, CA 94043

MIL-SPEC and EIA/JESD (JEDEC) speciﬁcations

800-854-7179 or

(Available from Global Engineering Documents)

303-397-7956

JEDEC Speciﬁcations

http://www.jedec.org

1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive

Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.

2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its

Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.

Power Supply and Power Sequencing

This section provides design considerations for the MPC866/859 power supply. The MPC866/859 has a

core voltage (VDDL) and PLL voltage (VDDSYN) that operates at a lower voltage than the I/O voltage

VDDH. The I/O section of the MPC866/859 is supplied with 3.3 V across VDDH and VSS (GND).

Signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, and

MII_MDIO are 5-V tolerant. All inputs cannot be more than 2.5 V greater than VDDH. In addition, 5-V

tolerant pins cannot exceed 5.5 V and the remaining input pins cannot exceed 3.465 V. This restriction

applies to power up/down and normal operation.

One consequence of multiple power supplies is that when power is initially applied the voltage rails ramp

up at different rates. The rates depend on the nature of the power supply, the type of load on each power

supply, and the manner in which different voltages are derived. The following restrictions apply:

•

VDDL must not exceed VDDH during power up and power down.

•

VDDL must not exceed 1.9 V and VDDH must not exceed 3.465 V.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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