CS1237

R

1

第

页

目 录

版本历史 ..........................................................................................................................................2

目 录 ................................................................................................................................................3

1

芯片功能说明...........................................................................................................................5

1.1

芯片主要功能特性...................................................................................................5

1.2

芯片应用场合...........................................................................................................5

1.3

芯片基本结构功能描述...........................................................................................6

1.4

芯片绝对最大极限值...............................................................................................7

1.5

CS1237 数字逻辑特性.............................................................................................7

1.6

CS1237 电气特性 .....................................................................................................8

1.7

芯片引脚...................................................................................................................9

2

芯片功能模块描述.................................................................................................................10

2.1

模拟输入前端.........................................................................................................10

2.2

温度传感器.............................................................................................................10

2.3

低噪声 PGA 放大器...............................................................................................11

2.4

时钟信号源.............................................................................................................12

2.5

复位和断电(POR&power down) ...........................................................................12

2.6

SPI 串口通信 ..........................................................................................................13

2.6.1

建立时间.................................................................................................................13

2.6.2

ADC 数据输出速率................................................................................................14

2.6.3

数据格式.................................................................................................................14

2.6.4

数据准备/数据输入输出(

DOUT

DRDY /

) .......................................................14

2.6.5

串行时钟输入(SCLK)............................................................................................14

2.6.6

数据发送.................................................................................................................15

2.6.7

功能配置.................................................................................................................16

2.6.7.1

SPI 命令字 ...............................................................................................16

2.6.7.2

SPI 寄存器 ...............................................................................................17

2.6.8

Power down 模式....................................................................................................18

3

芯片的封装.............................................................................................................................19