TLV9001UIDBVR datasheet(26/81 Pages) TI1

26 / 81 page

TLV9001, TLV9002, TLV9004

SBOS833L – OCTOBER 2017 – REVISED MAY 2019

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Product Folder Links: TLV9001 TLV9002 TLV9004

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Feature Description (continued)

The SHDN pins are high-impedance CMOS inputs. Dual op amp versions are independently controlled and quad

op amp versions are controlled in pairs with logic inputs. For battery-operated applications, this feature may be

used to greatly reduce the average current and extend battery life. The enable time is 10 µs for full shutdown of

all channels; disable time is 3 µs. When disabled, the output assumes a high-impedance state. This architecture

allows the TLV9002S and TLV9004S to operate as a gated amplifier (or to have the device output multiplexed

onto a common analog output bus). Shutdown time (tOFF) depends on loading conditions and increases as load

resistance increases. To ensure shutdown (disable) within a specific shutdown time, the specified 10-kΩ load to

midsupply (VS / 2) is required. If using the TLV9001S, TLV9002S or TLV9004S without a load, the resulting

turnoff time significantly increases.

8.4 Device Functional Modes

The TLV900x family has a single functional mode. The devices are powered on as long as the power-supply

voltage is between 1.8 V (±0.9 V) and 5.5 V (±2.75 V).

TLV9001UIDBVR 数据表(PDF) 26 Page - Texas Instruments