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TLV9001UIDBVR 数据表(PDF) 39 Page - Texas Instruments

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部件名 TLV9001UIDBVR
功能描述  Low-Power, RRIO, 1-MHz Operational Amplifier for Cost-Sensitive Systems
PDF  81 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TLV9001UIDBVR 数据表(HTML) 39 Page - Texas Instruments

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Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLV9004SIRTER
WQFN
RTE
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV9001IDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TLV9001IDCKR
SC70
DCK
5
3000
190.0
190.0
30.0
TLV9001IDPWR
X2SON
DPW
5
3000
205.0
200.0
33.0
TLV9001SIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
TLV9001TIDCKR
SC70
DCK
5
3000
190.0
190.0
30.0
TLV9001UIDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
TLV9002IDGKR
VSSOP
DGK
8
2500
366.0
364.0
50.0
TLV9002IDGKT
VSSOP
DGK
8
250
366.0
364.0
50.0
TLV9002IDR
SOIC
D
8
2500
336.6
336.6
41.3
TLV9002IDSGR
WSON
DSG
8
3000
210.0
185.0
35.0
TLV9002IDSGT
WSON
DSG
8
250
210.0
185.0
35.0
TLV9002IPWR
TSSOP
PW
8
2000
366.0
364.0
50.0
TLV9002SIDGSR
VSSOP
DGS
10
2500
366.0
364.0
50.0
TLV9002SIRUGR
X2QFN
RUG
10
3000
205.0
200.0
33.0
TLV9004IDR
SOIC
D
14
2500
336.6
336.6
41.3
TLV9004IPWR
TSSOP
PW
14
2000
366.0
364.0
50.0
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2019
Pack Materials-Page 2



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