ADL8111ACCZN-R7 datasheet(5/24 Pages) AD

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Data Sheet

ADL8111

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

VDD_PA

+7 V dc

VDD_SW Range

−0.3 V to +3.7 V

VSS_SW Range

−3.7 V to +0.3 V

Control Voltage (VA, VB) Range

−0.3 V to VDD +

0.3 V

RF Input Power (RFIN) − Internal Amplifier State

20 dBm

RFIN − Internal Bypass,

External Bypass A, External Bypass B

31 dBm

RFIN (IN_A, OUT_A, IN_B, and OUT_B)

Termination Path (VDD_SW, VA, VB = 3.3 V,

VSS = −3.3 V, TA = 85°C, and Frequency =

2 GHz)

28 dBm

Hot Switch Power Level (IN_A, OUT_A, IN_B,

and OUT_B), VDD_SW = 3.3 V, TA = 85°C,

and Frequency = 2 GHz

30 dBm

Hot Switch Power Level (Internal Amplifier

State)

20 dBm

Continuous Power Dissipation, PDISS

(TA = 85°C, Derate 6.8 mW/°C Above 85°C)

0.61 W

Channel Temperature

175°C

Maximum Peak Reflow Temperature

(Moisture Sensitivity Level 3, MSL3)1

260°C

Storage Temperature Range

−40°C to +125°C

Operating Temperature Range

−40°C to +85°C

ESD Sensitivity (Human Body Model)

Class 1B

(Passed ±750 V)

See the Ordering Guide section for additional information.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to the printed circuit

board (PCB) design and operating environment. Careful

attention to PCB thermal design is required.

θJC is the junction to case thermal resistance.

Table 6. Thermal Resistance

Package Type

θJC

Unit

CC-28-31

148

°C/W

θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

ground paddle to the PCB, and the ground paddle is held constant at an

85°C operating temperature.

POWER DERATING CURVES

–5

–10

–15

–20

–25

0.01

0.1

100

10k

FREQUENCY (MHz)

Figure 2. Power Derating for RFIN Port

–4

–6

–8

–2

–10

–12

–14

–16

–18

10k

100k

10M

100M

10G

FREQUENCY (Hz)

Figure 3. Power Derating for Terminated Path

–4

–6

–8

–2

–10

–12

–14

–16

–18

10k

100k

10M

100M

10G

FREQUENCY (Hz)

Figure 4. Power Derating for Hot Switching Power

ESD CAUTION

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