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TMS320DM643 数据表(PDF) 63 Page - Texas Instruments

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部件名 TMS320DM643
功能描述  Video/Imaging Fixed-Point Digital Signal Processo
PDF  160 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TMS320DM643 数据表(HTML) 63 Page - Texas Instruments

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4.3
Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
TMS320DM643
Video/Imaging Fixed-Point Digital Signal Processor
SPRS269A – FEBRUARY 2005 – REVISED APRIL 2005
Case Temperature (Unless Otherwise Noted)
PARAMETER
TEST CONDITIONS (1)
MIN
TYP
MAX
UNIT
VOH
High-level output voltage
DVDD = MIN, IOH = MAX
2.4
V
VOL
Low-level output voltage
DVDD = MIN, IOL = MAX
0.4
V
VI = VSS to DVDD no opposing internal
±10
uA
resistor
VI = VSS to DVDD opposing internal pullup
II
Input current
50
100
150
uA
resistor (2)
VI = VSS to DVDD opposing internal
–150
–100
–50
uA
pulldown resistor (2)
EMIF, CLKOUT4, CLKOUT6, EMUx
–16
mA
Video Ports, Timer, TDO, GPIO
IOH
High-level output current
–8
mA
(Excluding GP0[2:1]), McBSP
HPI
–0.5
mA
EMIF, CLKOUT4, CLKOUT6, EMUx
16
mA
Video Ports, Timer, TDO, GPIO
8
mA
(Excluding GP0[2:1]), McBSP
IOL
Low-level output current
SCL0 and SDA0
3
mA
HPI
1.5
mA
IOZ
Off-state output current
VO = DVDD or 0 V
±10
uA
CVDD = 1.4 V, CPU clock = 600 MHz
890
mA
ICDD
Core supply current(3)
CVDD = 1.2 V, CPU clock = 500 MHz
620
mA
DVDD = 3.3 V, CPU clock = 600 MHz
210
mA
IDDD
I/O supply current(3)
DVDD = 3.3 V, CPU clock = 500 MHz
165
mA
Ci
Input capacitance
10
pF
Co
Output capacitance
10
pF
(1)
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
(2)
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
(3)
Measured with average activity (50% high/50% low power) at 25°C case temperature and 133-MHz EMIF for -600 speed (100-MHz
EMIF for -500 speed). This model represents a device performing high-DSP-activity operations 50% of the time, and the remainder
performing low-DSP-activity operations. The high/low-DSP-activity models are defined as follows:
High-DSP-Activity Model:
CPU: 8 instructions/cycle with 2 LDDW instructions [L1 Data Memory: 128 bits/cycle via LDDW instructions;
L1 Program Memory: 256 bits/cycle; L2/EMIF EDMA: 50% writes, 50% reads to/from SDRAM (50% bit-switching)]
McBSP: 1 channel at 2.048 MHz
Timers: 2 timers at maximum rate
Low-DSP-Activity Model:
CPU: 2 instructions/cycle with 1 LDH instruction [L1 Data Memory: 16 bits/cycle; L1 Program Memory: 256 bits per 4 cycles;
L2/EMIF EDMA: None]
McBSP: 1 channel at 2.048 MHz
Timers: 2 timers at maximum rate
The actual current draw is highly application-dependent. For more details on core and I/O activity, refer to the TMS320DMx Power
Consumption Summary application report (literature number SPRA962).
Device Operating Conditions
63



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