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TMS320DM643 数据表(PDF) 63 Page - Texas Instruments |
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TMS320DM643 数据表(HTML) 63 Page - Texas Instruments |
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63 / 160 page ![]() www.ti.com 4.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating TMS320DM643 Video/Imaging Fixed-Point Digital Signal Processor SPRS269A – FEBRUARY 2005 – REVISED APRIL 2005 Case Temperature (Unless Otherwise Noted) PARAMETER TEST CONDITIONS (1) MIN TYP MAX UNIT VOH High-level output voltage DVDD = MIN, IOH = MAX 2.4 V VOL Low-level output voltage DVDD = MIN, IOL = MAX 0.4 V VI = VSS to DVDD no opposing internal ±10 uA resistor VI = VSS to DVDD opposing internal pullup II Input current 50 100 150 uA resistor (2) VI = VSS to DVDD opposing internal –150 –100 –50 uA pulldown resistor (2) EMIF, CLKOUT4, CLKOUT6, EMUx –16 mA Video Ports, Timer, TDO, GPIO IOH High-level output current –8 mA (Excluding GP0[2:1]), McBSP HPI –0.5 mA EMIF, CLKOUT4, CLKOUT6, EMUx 16 mA Video Ports, Timer, TDO, GPIO 8 mA (Excluding GP0[2:1]), McBSP IOL Low-level output current SCL0 and SDA0 3 mA HPI 1.5 mA IOZ Off-state output current VO = DVDD or 0 V ±10 uA CVDD = 1.4 V, CPU clock = 600 MHz 890 mA ICDD Core supply current(3) CVDD = 1.2 V, CPU clock = 500 MHz 620 mA DVDD = 3.3 V, CPU clock = 600 MHz 210 mA IDDD I/O supply current(3) DVDD = 3.3 V, CPU clock = 500 MHz 165 mA Ci Input capacitance 10 pF Co Output capacitance 10 pF (1) For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table. (2) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor. (3) Measured with average activity (50% high/50% low power) at 25°C case temperature and 133-MHz EMIF for -600 speed (100-MHz EMIF for -500 speed). This model represents a device performing high-DSP-activity operations 50% of the time, and the remainder performing low-DSP-activity operations. The high/low-DSP-activity models are defined as follows: • High-DSP-Activity Model: – CPU: 8 instructions/cycle with 2 LDDW instructions [L1 Data Memory: 128 bits/cycle via LDDW instructions; L1 Program Memory: 256 bits/cycle; L2/EMIF EDMA: 50% writes, 50% reads to/from SDRAM (50% bit-switching)] – McBSP: 1 channel at 2.048 MHz – Timers: 2 timers at maximum rate • Low-DSP-Activity Model: – CPU: 2 instructions/cycle with 1 LDH instruction [L1 Data Memory: 16 bits/cycle; L1 Program Memory: 256 bits per 4 cycles; L2/EMIF EDMA: None] – McBSP: 1 channel at 2.048 MHz – Timers: 2 timers at maximum rate The actual current draw is highly application-dependent. For more details on core and I/O activity, refer to the TMS320DMx Power Consumption Summary application report (literature number SPRA962). Device Operating Conditions 63 |
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