Symbol

mm

Min.

Typ.

Max.

A

0.456

0.50

0.544

A1

0.179

195

0.211

A2

0.255

0.28

0.305

A3

0.022

0.025

0.028

E

2.563

2.593

2.623

D

2.563

2.593

2.623

E1

1.6 BSC

D1

1.6 BSC

e

0.4 BSC

b

0.245

0.295

n

25

Tolerance of form and position

aaa

0.03

bbb

0.06

ccc

0.05

ddd

0.015

Note:

WLCSP stands for wafer level chip scale package. The typical ball diameter before mounting is 0.25 mm. The

terminal A1 corner must be identified on the top surface by using a laser marking dot.

STUSB4500

WLCSP (2.6x2.6x0.5) 25 bumps package information

DS12499 - Rev 2

page 32/41