eGaN® FET DATASHEET

EPC2016C

EPC – THE LEADER IN GaN TECHNOLOGY | WWW.EPC-CO.COM | COPYRIGHT 2019 |

| 6

Information subject to

change without notice.

Revised August, 2019

Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to

improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights, nor the rights of others.

eGaN® is a registered trademark of Efficient Power Conversion Corporation.

EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx

180

180

X3

2106

X4

3

4

5

6

1

2

RECOMMENDED

LAND PATTERN

(units in µm)

Pad no. 1 is Gate;

Pads no. 3, 5 are Drain;

Pads no. 4, 6 are Source;

*Substrate pin should be connected to Source

The land pattern is solder mask defined.

DIE OUTLINE

Solder Bar View

Side View

DIM

MICROMETERS

MIN

Nominal

MAX

A

2076

2106

2136

B

1602

1632

1662

c

1379

1382

1385

d

577

580

583

e

235

250

265

f

195

200

205

g

400

400

400

A

e

g

3

4

5

6

g

X3

f

f

2

1

X4

Seating Plane

Recommended stencil should be 4mil (100 µm)

thick, must be laser cut , opening per drawing.

The corner has a radius of R60

Intended for use with SAC305 Type 3 solder,

reference 88.5% metals content.

Additional assembly resources available at

https://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx

RECOMMENDED

STENCIL DRAWING

(measurements in µm)

Pad no. 1 is Gate;

Pads no. 3, 5 are Drain;

Pads no. 4, 6 are Source;

Pad no. 2 is Substrate. *

*Substrate pin should be connected to Source

180

180

2106

3

4

5

6

1

2