EPC2016C datasheet(1/6 Pages) EPC

部件名	EPC2016C

功能描述	Enhancement Mode Power Transistor

PDF	6 Pages

Scroll/Zoom	100%

制造商	EPC [Espros Photonics corp]

网页	http://www.espros.ch

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eGaN® FET DATASHEET

EPC2016C

| 1

EPC2016C eGaN® FETs are supplied only in

passivated die form with solder bars.

Die size: 2.1 x 1.6 mm

Applications

• High Speed DC-DC conversion

• Class-D Audio

• High Frequency Hard-Switching and

Soft-Switching Circuits

Benefits

• Ultra High Efficiency

• Ultra Low RDS(on)

• Ultra Low QG

• Ultra Small Footprint

EFFICIENT POWER CONVERSION

HAL

EPC2016C – Enhancement Mode Power Transistor

VDS , 100V

RDS(on) , 16 mΩ

ID , 18 A

G

D

S

Maximum Ratings

PARAMETER

VALUE

UNIT

VDS

Drain-to-Source Voltage (Continuous)

100

V

Drain-to-Source Voltage (up to 10,000 5 ms pulses at 150°C)

120

V

ID

Continuous (TA = 25°C, RθJA = 13.4°C/W)

18

A

Pulsed (25°C, TPULSE = 300 µs)

75

VGS

Gate-to-Source Voltage

6

V

Gate-to-Source Voltage

-4

TJ

Operating Temperature

–40 to 150

°C

TSTG Storage Temperature

–40 to 150

Thermal Characteristics

PARAMETER

TYP

UNIT

RθJC

Thermal Resistance, Junction-to-Case

2

°C/W

RθJB

Thermal Resistance, Junction-to-Board

4

RθJA

Thermal Resistance, Junction-to-Ambient (Note 1)

69

Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board.

See https://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for details.

All measurements were done with substrate connected to source.

Static Characteristics (TJ = 25°C unless otherwise stated)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

BVDSS

Drain-to-Source Voltage

VGS = 0 V, ID = 300 μA

100

V

IDSS

Drain-Source Leakage

VGS = 0 V, VDS = 80 V

25

150

µA

IGSS

Gate-to-Source Forward Leakage

VGS = 5 V

0.5

3

mA

Gate-to-Source Reverse Leakage

VGS = -4 V

0.15

0.25

mA

VGS(TH)

Gate Threshold Voltage

VDS = VGS, ID = 3 mA

0.8

1.4

2.5

V

RDS(on)

Drain-Source On Resistance

VGS = 5 V, ID = 11 A

12

16

mΩ

VSD

Source-Drain Forward Voltage

IS = 0.5 A, VGS = 0 V

1.8

V

Gallium Nitride’s exceptionally high electron mobility and low temperature coefficient allows very

low RDS(on), while its lateral device structure and majority carrier diode provide exceptionally low QG

and zero QRR. The end result is a device that can handle tasks where very high switching frequency,

and low on-time are beneficial as well as those where on-state losses dominate.

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