RA32E1-RUT-FR datasheet(14/20 Pages) REFOND

部件名	RA32E1-RUT-FR

功能描述	This production use the PLCC-2 package竊똮utline size 2.83.50.65mm

PDF	20 Pages

Scroll/Zoom	100%

制造商	REFOND [SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.]

网页	http://www.refond.com/

标志

14 / 20 page

Tel: +86-755-66839118

Fax:+86-755-66839300

E-mail:uvsales@refond.com

eb: www.refonduv.com

PAGE:14

REFOND:WI-E-045

A/3

REV:E/3

TG-201709070731NP

3. SMT Reflow Soldering Instructions SMT

回流焊说明

3.1 SMT Reflow Soldering Instructions SMT

Fig.3-1 SMT Reflow Soldering Instructions

Table 3-1 SMT Reflow Soldering Instructions

Average temperature rise speed

Tsmax

Max 3 °C/ s

3 °C/

Preheating: minimum temperature

(Tsmin)

150 °C

Preheating: Max temperature

(Tsmax)

200 °C

Preheating: Time

Tsmin

Tsmax

60s-120s

60 - 120

Time limited to maintain high temperature: the temperature

(TL)

217 °C

Time limited to maintain high temperature: The Time

(tL)

Max 60s

Peak /Classification of temperature:

(TP)

260 °C

Time limit classification of peak temperature time

Max 10s

Hold time within 5 C with the actual peak temperature (TP)

(TP)

5 °C

Max 30s

Cooling speed

Max 6 °C/ s

6 °C/

Needed time from 25 °C to Tp

25 °C

Max 8 minutes

Preheat

TS min

TS max

Ramp-up

Critical Zone

to T

Ramp-down

t 25℃ to Peak

Time

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