数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

RA32E1-RUT-FR 数据表(PDF) 15 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

部件名 RA32E1-RUT-FR
功能描述  This production use the PLCC-2 package竊똮utline size 2.8*3.5*0.65mm
PDF  20 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  REFOND [SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.]
网页  http://www.refond.com/
标志 REFOND - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

RA32E1-RUT-FR 数据表(HTML) 15 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

Back Button RA32E1-RUT-FR Datasheet HTML 11Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 12Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 13Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 14Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 15Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 16Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 17Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 18Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 19Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. Next Button
Zoom Inzoom in Zoom Outzoom out
 15 / 20 page
background image
Tel: +86-755-66839118
Fax:+86-755-66839300
E-mail:uvsales@refond.com
W
eb: www.refonduv.com
PAGE:15
REFOND:WI-E-045
A/3
REV:E/3
TG-201709070731NP
Notes
(1)Reflow soldering should not be done more than twice. If more than 24 hours between the two solderings ,
LED will be damaged.
(2)When soldering , do not put stress on the LEDs during heating.
3.1.1 Soldering Iron
(1) When do soldering by hand, keep the temperature of iron below less 300℃ less than 3 seconds.
(2) Soldering by hand should be done only one time.
3.1.2 Repairing
Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,a double-
head soldering iron should be used (as below figure). It should be confirmed in advance whether the
characteristics of LEDs will or not be damaged by repairing.
LED
3.1.3 Cautions
(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of
package. The pressure to the top surface will be impacted on the reliability of the LEDs. Precautions should be
taken to avoid the strong pressure on the encapsulated part. So when usethe picking up nozzle, the pressure on
the silicone resin should be proper. LED
(2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp
the circuit board.LED
(3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after
soldering. Do not rapidly cool device after soldering.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com