TLE5014C16 datasheet(39/45 Pages) INFINEON

39 / 45 page

Final Datasheet

Rev. 1.0

2018-04-04

TLE5014

Package Information

The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant.

7.1

Package Parameters

Tilt angle

Reference plane

Rotational

displacement

Package

Chip

Die pad

Chip

Figure 7-1 Tolerance of the die in the package

The active area of the GMR sensing element is 360µm x 470µm.

It has to be ensured that a magnet is used which has sufficient size to provide a homogeneous magnetic field

over the total sensing element area. For a practical application design this means that the magnet has to be

Table 7-1

Package Parameters

Parameter

Symbol Limit Values

Unit

Notes

Min. Typ. Max.

Thermal resistance

RthJA

150

K/W

Junction to air1)

1) according to Jedec JESD51-7

RthJC

K/W

Junction to case

RthJL

K/W

Junction to lead

Moisture Sensitively Level MSL 3

260°C2)

2) suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020E (December 2014)

Lead Frame

Plating

Sn 100%

> 7 μm

Table 7-2

Position of the die in the package

Parameter

Symbol Limit Values

Unit

Notes

Min. Typ. Max.

Tilt

in respect to the z-axis and

reference plane (see

Figure 7-1),

Rotational displacement

in respect to the reference

axis (see Figure 7-1)

Placement tolerance in

package

100

µm

in x and y direction

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