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ST33TPHF2ESPI 数据表(PDF) 17 Page - STMicroelectronics |
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ST33TPHF2ESPI 数据表(HTML) 17 Page - STMicroelectronics |
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17 / 26 page ![]() 7 Package marking information The two figures below illustrate the typical markings of the TSSOP28 and the VQFN32 device packages, respectively. Figure 14. TSSOP28 device package marking area A B C D F E H J G a A: Marking area B: Assembly plant C: BE sequence D: Diffusion plant E: Assembly year F: Assembly week G: ECOPACK level H: ST logo J: Marking area - 2 digits a: Dot Figure 15. VQFN32 device package marking area A B C D E F G I J H K A: Marking area B: Assembly plant C: BE sequence D: Diffusion plant E: Country of origin F: Assembly year G: Assembly week H: ECOPACK I: ST logo J: Marking area - 2 digits K: Dot For both packages, the 6-digit ‘A’ marking area is equal to "PXYZZZ", with: • Y = Hardware revision • ZZZ = Product identifier ST33TPHF2ESPI Package marking information DB2716 - Rev 4 page 17/26 |
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