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ST33TPHF2ESPI 数据表(PDF) 25 Page - STMicroelectronics

部件名 ST33TPHF2ESPI
功能描述  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

ST33TPHF2ESPI 数据表(HTML) 25 Page - STMicroelectronics

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List of figures
Figure 1.
TSSOP28 pinout................................................................... 5
Figure 2.
VQFN32 pinout.................................................................... 5
Figure 3.
Typical hardware implementation (TSSOP28 package) ........................................ 7
Figure 4.
Mandatory filtering capacitors on VPS .................................................... 8
Figure 5.
TSSOP28 - outline ................................................................. 9
Figure 6.
TSSOP28 - recommended footprint..................................................... 10
Figure 7.
VFQFPN32 - outline ............................................................... 11
Figure 8.
VFQFPN32 - recommended footprint.................................................... 12
Figure 9.
Reel diagram .................................................................... 14
Figure 10.
Embossed carrier tape for VFQFPN 5 × 5 mm ............................................. 15
Figure 11.
Chip orientation in the embossed carrier tape for VFQFPN 5 × 5 mm.............................. 15
Figure 12.
Embossed carrier tape for TSSOP28 4.4 mm body width ...................................... 16
Figure 13.
Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width ...................... 16
Figure 14.
TSSOP28 device package marking area ................................................. 17
Figure 15.
VQFN32 device package marking area .................................................. 17
ST33TPHF2ESPI
List of figures
DB2716 - Rev 4
page 25/26



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