Revision history

Date

Version

Changes

12-Nov-2015

1

Initial release.

26-Apr-2018

2

In Features, updated:

•

TPM features.

•

Temperature range.

•

Updated CC and FIPS certification status.

•

Supported cryptographic algorithms

•

Product compliance

Updated Appendix B: Referenced documents and references in the data brief.

Updated Section 1.1: Security certifications.

Added Section 2: Data brief scope.

Updated Section 3: Pin and signal description.

Added Section 4: Integration guidance.

Added Section 9: Ordering information.

Updated document reference to DB2716.

Small text changes.

04-Jul-2019

3

Added STSAFE-TPM logo on cover page.

Updated Product compliance.

Reorganized Section 1 Description.

Updated Section 2.1 ST33TPHF2ESPI products and Section 2.2 Firmware

image.

Updated product marking. See:

•

Section 2.1 ST33TPHF2ESPI products

•

Section 7 Package marking information

•

Section 8 Ordering information

Updated Figure 6. TSSOP28 - recommended footprint.

Added Section 5.3 Thermal characteristics of packages.

Removed list of references.

Small text changes.

12-Nov-2019

4

Updated data brief for firmware version 49.40 (73.64 in decimal):

•

Updated Section 2.1 ST33TPHF2ESPI products.

•

Updated Section 2.2 Firmware image.

•

Updated descriptions of SPI_RST and GPI in Section 3 Pin and signal

description.

•

Added optional external pull-up resistor to GPI line in Figure 3. Typical

hardware implementation (TSSOP28 package).

•

•

Updated Figure 14. TSSOP28 device package marking area.

•

Updated Table 9. Ordering information for ST33TPHF2ESPI products.

•

Added Section 9 Firmware image overview.

Small text changes.

ST33TPHF2ESPI

DB2716 - Rev 4

page 22/26