TPS709

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SBVS186G – MARCH 2012 – REVISED NOVEMBER 2015

Changes from Revision D (October 2013) to Revision E

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Changed DRV (SON-6) package status from Preview to Production Data............................................................................ 1

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Deleted SON-6 package from footnote 1 in Features section................................................................................................ 1

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Deleted DRV package from pinout diagram note................................................................................................................... 1

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Deleted DRV from pinout note in the Pin Configurations section........................................................................................... 4

Changes from Revision C (June 2013) to Revision D

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Changed device status from Production Data to Mixed Status.............................................................................................. 1

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Changed last Features bullet: added footnote and changed device order............................................................................. 1

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Added note to pinout diagrams............................................................................................................................................... 1

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Added product preview footnote to pin configurations ........................................................................................................... 4

Changes from Revision B (November 2012) to Revision C

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Added DCY (SOT-223) and DRV (SON) packages to data sheet ......................................................................................... 1

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Changed quiescent current value in first paragraph of Description section from 1.35 µA to 1 µA ........................................ 1

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Changed text in second paragraph of Description section from "leakage" to "shutdown." .................................................... 1

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Added typical application circuit ............................................................................................................................................. 1

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Added DCY and DRV packages to Pin Configuration section .............................................................................................. 4

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Added DCY and DRV packages to Pin Descriptions table ................................................................................................... 4

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Added DRV and DCY packages to Thermal Information table .............................................................................................. 5

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Changes from Revision A (October 2012) to Revision B

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Added Pin Configuration section ............................................................................................................................................ 4

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Changed Line regulation and Load regulation parameters in Electrical Characteristics table ............................................... 6

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Changed footnote 4 in Electrical Characteristics table........................................................................................................... 6

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Changed second paragraph of Dropout Voltage section ..................................................................................................... 13

Changes from Original (March 2012) to Revision A

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Changed device status from Product Preview to Production Data ........................................................................................ 1

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